- 英文名称4,4'-(Perfluoropropane-2,2-Diyl)Bis(1,2-Dimethylbenzene)
- 中文名称2,2-双(3,4-二甲苯基)六氟丙烷
- IUPAC名称4,4'-(perfluoropropane-2,2-diyl)bis(1,2-dimethylbenzene)
- 其它别名2,2-双(3,4-二甲基苯基)六氟丙烷; Hexafluoro-2,2-Bis-(3,4-Dimethylphenyl)-Propane
- CAS编号65294-20-4
- MFCD编号:MFCD00042167
- EINECS号:265-687-3
- FDA UNII编号:B2YCH6D3G6
- 分子式:C19H18F6
- 分子量:360.34
- 产品CID: 1635432
- 产品分类有机原料→分子砌块→芳环类化合物→苯类化合物
上下游产品
CAS号95-47-6 邻二甲苯 | CAS号684-16-2 六氟丙酮 | CAS号2379-17-1 1-(3,4-dimethyl... | CAS号1107-00-2 六氟二酐 | CAS号3016-76-0 4,4'-(六氟异丙烯)二邻苯二甲酸合成工艺路线路线简述
- 合成目标产物 2,2-Bis(3,4-Dimethylphenyl)Hexafluoropropane 主要起始原料 1,1,1,3,3,3-Hexafluoropropane-2,2-Diol And O-Xylene
- (文献来源)合成步骤主要原料 1,1,1,3,3,3-Hexafluoropropane-2,2-Diol 和 O-Xylene
2,2-Bis(3,4-Dimethylphenyl)Hexachloropropane置于nickel(II) Fluoride,氢氟酸体系中,用 二氯甲烷 作为反应溶剂,100.0 °C,1.0 Mpa 条件下,反应 8.0H,反应生成 2,2-双(3,4-二甲苯基)六氟丙烷
参考文献:Wo2022/184016
标题:Wo2022/184016
专利信息
专利号:US-7317110-B2
优先权日:2005-02-04
标题:Low dielectric constant organo-soluble polyimides
发明人:CHERN YAW-TERNG
权利人:HOME SUN IND CO LTD
摘要:The present invention provides a series of easily processable poly(ether-imide)s that are organic-soluble and afford low dielectric constants of films, their organic solutions and their manufacturing process. The poly(ether-imide)s is prepared from a dianhydride and a diamine, wherein the diamine is a diamine having tert-butyl group, i.e. 2,6-di-tert-butyl-4-(4-aminopheny)-1-(4-aminophenoxy)benzene the present invention is also direction to synthesis of this special diamine.
专利号:US-2012329958-A1
优先权日:2011-06-01
标题:Polymer synthesis and thermally rearranged polymres as gas separation membranes
发明人:FREEMAN BENNY D; SANDERS DAVID; RIBEIRO JR CLAUDIO P; SMITH ZACHARY; MCGRATH JAMES E; GUO RUILAN
权利人:FREEMAN BENNY D; SANDERS DAVID; RIBEIRO JR CLAUDIO P; SMITH ZACHARY; MCGRATH JAMES E; GUO RUILAN; VIRGINIA TECH INTELL PROP; UNIV TEXAS
摘要:The present invention includes a polymer formed by the thermal rearrangement of an ortho-functional polyimide synthesized via chemical imidization with permeation properties for gas separation membranes higher than those synthesized via thermal imidization and a method for forming that polymer having tailored transport properties and different chemical resistance. The present invention also includes a polymer formed by the thermal rearrangement of an ortho-functional polyimide in which a portion of the ortho-position functional group is lost during thermal rearrangement to yield a thermally rearranged polymer with higher permeability than would be seen without the ortho-position group. This ortho-position group can be the result of chemical imidization, or the result of a post-imidization modification reaction.
专利号:US-9675941-B2
优先权日:2014-04-30
标题 :Membranes for gas separation synthesized from polyimides containing 4-fluoro-4′,4″-diaminotriphenylmethane
发明人:GUZMAN LUCERO DIEGO JAVIER; GUZMAN PANTOJA JAVIER; PALOMEQUE SANTIAGO JORGE FROYLAN
权利人:MEXICANO INST PETROL
摘要:The present invention relates to the synthesis of linear aromatic polyimides and the production of membranes for the separation of gases. Specifically, polyimides featuring in their chemical structure, in the part derived from a diamine, 4-fluoro-4′,4″-diaminotriphenylmethane, and an aromatic dianhydride derived from tetracarboxylic acid. Polyimides are soluble in amidic solvents such as N,N′-dimethylformamide, N,N′-dimethylacetamide, N-methyl-2-pyrrolidone, etc., which are processed as dense membranes by controlled evaporation of the solvent. The resulting membranes are capable of separating at least a gaseous mixture constituted by two components such as H 2 /CH 4 , He/N 2 , H 2 /CO 2 , O 2 /N 2 , CO 2 /CH 4 and CO 2 /N 2 .
专利号:US-6518392-B2
优先权日:1999-06-11
标题 :Dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith
发明人:CARTER KENNETH R; HEDRICK JAMES L; LEE VICTOR YEE-WAY; MCHERRON DALE C; MILLER ROBERT D
权利人:IBM
摘要:A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.